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Electrical contact to molecules in semiconductor structures established for the first time

Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)
Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)

Electrical circuits are constantly being scaled down and extended with specific functions. A new method now allows electrical contact to be established with simple molecules on a conventional silicon chip. The technique promises to bring advances in sensor technology and medicine, as reported in the journal Nature by chemists from the University of Basel and researchers from IBM Research – Zurich in Rüschlikon.

12 July 2018

Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)
Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)
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